http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-113304632-A

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filingDate 2021-05-20^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e904559039039d113ecd2fb1d1a5f52f
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_42250790242ba4e304c2addb77197cbe
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publicationDate 2021-08-27^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber CN-113304632-A
titleOfInvention An intelligent preparation process of electroless copper plating solution applied to PCB
abstract The invention relates to the technical field of PCB manufacturing and intelligent processing equipment, in particular to an intelligent preparation process of chemical copper plating solution applied to PCB. The present invention includes the following steps: 1) adding formaldehyde to the reaction device in parts by weight, adding copper sulfate pentahydrate to the filter screen of the reaction device, and rotating and stirring for 10 minutes; 2) sequentially adding 100 g/L of Sodium hydroxide solution, 4,4'-bipyridine, thioglycolic acid, 2-iodobenzene acetate, polyethylene glycol, deionized water, uniformly dispersed; 3) Add potassium sodium tartrate, potassium sodium tartrate, EDTA, rotate and stir for 10 minutes. The rotation of the stirring rod of the present invention can stir the raw materials in the filter screen to improve the mixing efficiency, while the rotation of the scraper makes the scraper scrape the inner wall of the filter screen, so that the raw materials and impurities adhering to the inner wall of the filter screen are scraped off, so as to prevent clogging of the filter screen. It is convenient for the disassembly and cleaning of the filter screen and the use of the operator.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-115282758-A
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priorityDate 2021-05-20^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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