http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-113481550-B
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D21-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D21-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D1-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D7-0614 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D7-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D21-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D21-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D1-04 |
| filingDate | 2021-08-02^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2022-04-29^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2022-04-29^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-113481550-B |
| titleOfInvention | Method for preparing low-warpage ultrathin electrolytic copper foil by subtractive method |
| abstract | The invention relates to a method for preparing a low-warpage ultrathin electrolytic copper foil by a subtractive method, which comprises the following steps: electrolytic foil generation, reduction treatment and water washing treatment, wherein the reduction treatment comprises the following steps: and D, supplying direct current, converting part of the copper foil on the smooth surface of the copper foil into copper ions by electrons, entering the electrolyte, converting the copper ions of the electrolyte into copper by electrons, and depositing the copper ions on the first negative plate and the second negative plate. The copper foil on the smooth surface of the copper foil is subjected to micro-etching by a certain thickness through reduction treatment, so that the surface of the copper foil subjected to stress caused by lattice difference between the copper and the cathode roller is subjected to micro-etching, and the warping of the obtained electrolytic copper foil can be effectively reduced; and the electrolyte processed by electrolytic foil can be recycled in the reduction processing, and the copper deposited on the first cathode plate and the second cathode plate in the reduction tank can be recycled, thereby being beneficial to reducing the production cost and effectively solving the technical problems of complex preparation process, high production cost and poor warping reduction effect in the prior art. |
| priorityDate | 2021-08-02^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
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