http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-113512661-B
Outgoing Links
Predicate | Object |
---|---|
classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C22C9-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C22C26-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C22C1-058 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B22F3-15 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B22F3-14 |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B22F3-15 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B22F3-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C22C1-05 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C22C32-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C22C26-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C22C9-00 |
filingDate | 2021-04-23^^<http://www.w3.org/2001/XMLSchema#date> |
grantDate | 2022-04-29^^<http://www.w3.org/2001/XMLSchema#date> |
publicationDate | 2022-04-29^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | CN-113512661-B |
titleOfInvention | Diamond @ TiC enhanced high-strength conductive copper-based composite material and preparation method thereof |
abstract | The invention discloses a diamond @ TiC enhanced high-strength conductive copper-based composite material and a preparation method thereof, wherein the copper-based composite material comprises a copper base and a diamond @ TiC reinforcement, wherein the diamond @ TiC reinforcement accounts for 5-50% of the total mass of the copper-based composite material, the diamond @ TiC reinforcement is core-shell structure diamond @ TiC with a TiC interface layer, the TiC is mutually connected to form a network-shaped framework, and a copper base body is distributed among the network-shaped TiC frameworks. The copper-based composite material has excellent electric conductivity and heat conductivity, and higher strength, hardness and wear resistance. |
priorityDate | 2021-04-23^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
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