| abstract |
The invention discloses a high temperature resistant adhesive tape for semiconductor packaging and a preparation method thereof. The high temperature resistant adhesive tape comprises the following raw materials in parts by weight: 90-110 parts of high temperature resistant acrylic pressure-sensitive adhesive, 40-60 parts of ethyl acetate, 1-3 parts of ethyl acetate Epoxy curing agent, 1-3 parts of carbon nanotubes, 15-20 parts of modified epoxy resin; the use of high temperature resistant acrylic pressure-sensitive adhesive system makes the tape have good high temperature resistance effect, and the adhesive layer can withstand high temperature peel force changes Small, the tape is easy to remove after the packaging process, and there is no risk of epoxy resin leakage. At the same time, the high temperature resistant tape is not easy to fall off due to thermal oxidation aging, and anti-static treatment is carried out in the adhesive layer simultaneously, and the peeling voltage of the adhesive layer is less than 100V , effectively avoiding the contamination of semiconductor chips due to electrostatic adsorption of dust. |