| abstract |
The invention provides a curable resin composition, a method for producing the curable resin composition, a cured film obtained by curing the curable resin composition, a laminate comprising the cured film, a method for producing the cured film, and a semiconductor device comprising the cured film or the laminate, wherein the curable resin composition comprises a polyimideAt least one resin selected from the group consisting of precursors and polybenzoxazole precursors, a basic compound represented by the following formula (1-1) or a weak acid salt thereof, a polymerization initiator, and a solvent. |