http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-114023716-A

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filingDate 2021-11-16^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_83b49fd0f24c11d6c3844812b0c41433
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publicationDate 2022-02-08^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber CN-114023716-A
titleOfInvention A lead frame and its manufacturing method and a chip using the lead frame
abstract The invention discloses a lead frame, comprising a base plate on which a metal coating is arranged, the base plate including a plurality of units, each of the units including a base island and pins surrounding the base island, It also includes a resistor or/and a capacitor, the two poles of the resistor or/and the capacitor are coated with a metal coating, and the two poles of the resistor or/and the capacitor are respectively connected to the base island and the pin. The two poles of the resistor are directly connected to the base island and the pin, the distance between the resistor and the chip is close, and the line resistance between the resistor and the chip is almost negligible, so we can keep the resistance on different circuit boards stable. The two poles of the direct component capacitor are connected to the base island and the pin, and the distance between the capacitor and the peripheral circuit is far, so harmonics are generated due to interference.
priorityDate 2021-11-16^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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