| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_9272a547597a66278b30f2834d77f650 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-1572
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0204
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0228
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4697
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-007
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0152
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-308
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-043
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0542
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-10416
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0723
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-072 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-423
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-115
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-42
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-188
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-242
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-0094
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-0026
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0204
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-0047
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0206
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-422
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-181 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-42
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-02 |
| filingDate |
2021-05-14^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_70beb35600eb652cdae35ad8cb40ed47
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4f0ceda0d65f6bfc8fb50581615998fc
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d190fa7397af1acb0528b97369ef019e |
| publicationDate |
2022-06-10^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
CN-114615807-A |
| titleOfInvention |
Apparatus and Method for Forming PCB Engineered Thermal Paths Using Auxiliary Conductive Layers |
| abstract |
The present disclosure relates to apparatus and methods for forming PCB engineered thermal paths using auxiliary conductive layers. The method includes forming first and second auxiliary conductive layers on top and bottom surfaces of the PCB, respectively; milling or laser drilling the PCB from the top surface to form a first cavity extending into the PCB; by using a horizontal or vertical plating system Electroless plating with a first metal includes a top surface and a first side of the first cavity; plating the first side with a second metal by using a horizontal or vertical plating system to form a first plating on the first exposed surface of the PCB; plating and filling the first cavity; milling or laser drilling the PCB from the bottom surface to form a second cavity extending into the PCB, the first cavity being in thermal and/or electrical communication with the second cavity; electroless plating includes a bottom surface and a second side of the second cavity; and plating the second side with a second metal using a horizontal or vertical plating system to form a second metallization layer on the second exposed surface of the PCB and fill the second cavity. |
| priorityDate |
2020-12-09^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |