http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-115064618-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_1ed477a13427706bb8149816e32ce811 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-095 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2933-005 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2933-0033 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-005 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-483 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-54 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-00 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L33-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L33-48 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L33-54 |
| filingDate | 2022-08-17^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9993786495fc4979287d1538dc9ddfd2 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ca49a7283e1c8e80c29adb44efccf215 |
| publicationDate | 2022-09-16^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-115064618-A |
| titleOfInvention | A COB module packaging method |
| abstract | The invention relates to a COB module packaging method, which includes: providing a COB substrate, on which the COB substrate includes an array composed of a plurality of light-emitting chips; and performing plasma impact treatment on the non-light-emitting chip area on the surface of the COB substrate, so that the non-light-emitting chip area on the surface of the COB substrate A hydrophilic surface with atomic-level pits is formed; the opaque glue is applied to the non-light-emitting chip area on the surface of the COB substrate to form a first adhesive layer, so that the first adhesive layer is fully in contact with the hydrophilic surface with atomic-level pits, Perform self-leveling treatment on the first adhesive layer until the surface uniformity deviation of the first adhesive layer is within the range of 10%-50%; cover the first adhesive layer and the upper half of the light-emitting chip with light-transmitting glue to form a second adhesive layer . The invention realizes the self-leveling of the opaque adhesive layer on the substrate by pre-processing the substrate; the self-leveling can ensure that the thickness of the first adhesive layer is uniform, the surface of the first adhesive layer is smooth and smooth, and the apparent display effect is good. |
| priorityDate | 2022-08-17^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
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