http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-204204835-U

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filingDate 2014-11-26^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2015-03-11^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_798e27cfbab8ad0bfca0013b5fb4d18a
publicationDate 2015-03-11^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber CN-204204835-U
titleOfInvention Chip package structure
abstract The utility model provides a kind of chip package structure.Described chip package structure comprises wafer holder, is located at the wafer of described wafer holder, wire jumper and takes pin, and described wire jumper two ends connect described wafer respectively and describedly take pin, and described wire jumper comprises boss and runs through the cushion hole of described boss.The chip package structure that the utility model provides has the advantage that steadiness is strong and qualification rate is high.
priorityDate 2014-11-26^^<http://www.w3.org/2001/XMLSchema#date>
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