http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-216540836-U
Outgoing Links
Predicate | Object |
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assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_0672023ad24e50f37a7a100dd53705dd |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B08B5-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B22F3-03 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B08B15-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/F25D1-00 |
filingDate | 2021-12-22^^<http://www.w3.org/2001/XMLSchema#date> |
grantDate | 2022-05-17^^<http://www.w3.org/2001/XMLSchema#date> |
inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_aff6c015ff6340c6716edea969fec40f http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c90c2d31ba7725ea667e0cf39d852282 |
publicationDate | 2022-05-17^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | CN-216540836-U |
titleOfInvention | A titanium-based photosensitive metal organic framework hole mold device for easy demolding |
abstract | The utility model discloses a titanium-based photosensitive metal organic framework hole mold device for easy demolding, which comprises a bottom plate and a C-shaped frame. The two vertical sides of the C-shaped frame are respectively installed at both ends of the top of the bottom plate, and the center of the top of the bottom plate is located at the center of the bottom plate. A carrying plate is installed horizontally, a lower mold is installed on the top of the carrying plate, and a top plate is slid horizontally below the horizontal edge of the C-shaped frame, an upper mold is installed horizontally at the bottom center of the top plate, and the top of the horizontal edge of the C-shaped frame is provided with a mold. In the up and down movement mechanism for moving the top plate up and down, the two opposite vertical sides of the C-shaped frame are provided with a limiting mechanism for limiting the top plate, and a collection box is installed horizontally at one end of the top of the carrying plate. One of the vertical sides of the frame is provided with a heat dissipation mechanism for dissipating heat to the upper mold and the lower mold. The first copper block of the utility model moves to contact the second copper block, so that the fan can work, so that the upper mold and the lower mold can be blown for heat dissipation and impurity removal, thereby improving the practicability of the device. |
priorityDate | 2021-12-22^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
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