| abstract |
Method for producing an electrical connection between components (5) of a semiconductor component (1, 2) and microconnection elements (3, 4), the method comprising the following method steps: - Making a micro-connecting element (3, 4) having a coaxial construction with an inner flat conductor (6) as a first layer of conductive material, a second layer (7) of insulating material and a third layer (8) of conductive material, and wherein the first and third layers (6, 8) extend along a common center line (9) which is arranged in the region of the first layer (6) as a coaxial axis (17), - Producing components (5) of a semiconductor device (1, 2) with at least one contact pad pair (10) of coaxially arranged discs (26, 27), - Preparing the contact pad pair (10); - preparing the ends (33) of the layers (6, 8) of the microconnection element (3, 4); - Heating the component (5) for fixing the one end (33) of the micro-connecting element (3, 4) with at least two mutually insulated ... |