http://rdf.ncbi.nlm.nih.gov/pubchem/patent/DE-102005040789-A1

Outgoing Links

Predicate Object
assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_fd446fb0d73aa96d044fea2eaa3c8ebc
classificationCPCAdditional http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B2207-095
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C2203-0109
classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C1-00301
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B81C99-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B81B1-00
filingDate 2005-08-29^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9fda7090e39fd729f337719d3ab6cc30
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fa38a158a4a13094fda16d21699b2bc4
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_cb0034d5a0fefe3fe21ad5837d7c9b20
publicationDate 2007-03-01^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber DE-102005040789-A1
titleOfInvention Micromechanical device with anodically bonded cap and manufacturing process
abstract The invention is based on a micromechanical component with a cap wafer at least consisting of a first silicon substrate (1) and a thin glass substrate (2), with a functional wafer at least consisting of a second silicon substrate (5), with at least one electrical contact surface (5) on the functional wafer. 6) is arranged. The cap wafer is connected to the functional wafer on the glass substrate (2) by anodic bonding. The essence of the invention is that the electrical contact surface (6) is arranged on a side of the functional wafer facing the cap wafer and the cap wafer has at least one recess such that access (9) is provided to the electrical contact surface (6). The invention further relates to a method for encapsulating a micromechanical component with a cap wafer by anodic bonding of the cap wafer to a functional wafer.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/DE-102009045541-B4
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11130672-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2019030040-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/DE-102017213631-A1
priorityDate 2005-08-29^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

Predicate Subject
isDiscussedBy http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID5461123
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419559541

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