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filingDate 2007-11-27^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_42a79b04f6469b977612dddf5f458b81
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publicationDate 2008-06-26^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber DE-102007057370-A1
titleOfInvention Electronic component
abstract OnenElectronic component is disclosed. In one embodimentnthe electronic component comprises a frame comprising a base layer,na first layer, a second layer disposed on the first layernLayer comprising palladium, and one on the second layernarranged third layer comprising gold includes. A semiconductor chipnis arranged on the frame.
priorityDate 2006-12-08^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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