| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_36f8253f3d0d59bcd9259217d4385d10 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-2076
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-45144
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48764
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-45015
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48644
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-85207
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-49505
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48744
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-20755
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-85464
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01046
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01029
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01028
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48257
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48247
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-85444
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01082
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01079
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-48
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-49051
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01005
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-4903
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-45
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01014
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01013
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-49171
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48664
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-49175
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-45124 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49582
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-4952
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-49 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-495
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-50
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-60 |
| filingDate |
2007-11-27^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2013-09-12^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_42a79b04f6469b977612dddf5f458b81
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8eceac0602bc0a4464a968b112b80975 |
| publicationDate |
2013-09-12^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
DE-102007057370-B4 |
| titleOfInvention |
Electronic component and method for producing an electronic component with a lead frame |
| abstract |
An electronic component comprising: a carrier strip comprising: a base layer of copper material or an alloy of copper material or an alloy of iron material; a first layer of nickel material or an alloy of nickel material is provided on the base layer, the first layer coating at least one bonding wire attachment area on the carrier strip; a second layer of palladium material or an alloy of palladium material is provided on the first layer, the second layer coating at least the bonding wire attachment area on the carrier strip; and a third layer of gold material or an alloy of gold material is provided on the second layer, the third layer coating at least the bonding wire attachment area on the carrier strip; wherein the carrier strip further comprises a chip area and a plurality of lead conductors; a semiconductor chip arranged on the chip surface; one or more first bond wires extending between lead conductors and the semiconductor chip; and one or more second bond wires extending between lead conductors and the semiconductor chip; wherein the first bonding wires comprise a gold material or an alloy of gold material; and the second bonding wires comprise aluminum material or an alloy of aluminum material. |
| priorityDate |
2006-12-08^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |