| abstract |
Microsystem (100) with a first cavity (210) closed off from the environment, and a second cavity (310) closed off from the environment, wherein the first cavity (210) is bounded by a first bond (240) and the second cavity (310) is bounded by a second bond (340), characterized in that there is a first pressure (215) in the first cavity (210), and in the second cavity (310) there is a second pressure (315), wherein the first pressure (215) and the second pressure (315) have different amounts, wherein the first bond (240) comprises aluminum and gold and the second bond (340) comprises gold and silicon, wherein the second bond connection (340) is a eutectic bond or a diffusion solder bond. |