| abstract |
Component - with a substrate (S), - with a chip (CH), - With a frame (MF) which is connected to the substrate (S) and on which the chip (CH) rests, and with a sealing layer (SL) between the frame and the chip, which is set up to hermetically seal a volume enclosed by the substrate (S), the chip (CH) and the frame (MF), in which the sealing layer (SL) is an ink-jet print Represents structure and has metal particles (NP) or a mixture of polymer and metal particles (P, NP), in which the sealing layer (SL) has metallic nano-particles with diameters smaller than 10 nm after the application. |