| abstract |
A bond substrate is described having a bonding pad (4a) made of copper or a copper-based alloy for bonding wire (5). According to the invention it is provided that the contacting field (4a) is covered with a corrosion inhibitor layer which contains as active ingredient a heteroatom-containing aliphatic. In addition, an electronic module comprising such a bond substrate and a method of protecting wire-bonding surfaces from copper or a copper-base alloy from corrosion are disclosed. |