| abstract |
The present invention relates to a MEMS package (MEMS: microelectromechanical system) having a capping substrate with trenches of different depths, and a method of manufacturing the MEMS package. In some embodiments, a first trench in a first device region and a scribe trench in a scribe trench region are made on a front side of a capping substrate. Then, a hard mask is made over the capping substrate and patterned. When the hardmask is in place, an etch is performed on the capping substrate so that an uncovered portion of a bottom surface of the first trench is recessed while leaving a covered portion of the bottom surface of the first trench unchanged to create a stopper in the first trench , Then, the front side of the capping substrate is bonded to a device substrate so that the first trench is enclosed over a first MEMS device. |