| abstract |
A wafer processing method includes a polyester film supplying step of positioning a wafer in an inner opening of a ring frame and providing a polyester film on a back side of the wafer and a back side of the ring frame, a joining step of heating the polyester film while applying a pressure to the polyester film, thereby Bonding a wafer and the ring frame over the polyester film by thermocompression bonding, a dividing step of cutting the wafer using a cutter to thereby split the wafer into individual device chips, and a receiving step of receiving each device chip from the polyester film. |