| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_a9ac46a3527876c6a5082aabd4b2e964 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H04R2201-003
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C2203-0109
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B2207-012
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B2201-0257 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H04R1-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H04R1-083
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B7-0064
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H04R19-04 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H04R1-02 |
| filingDate |
2020-12-17^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6496c0982026573ef337517618f3ba43
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a209880693e4198f4d627a8ac7d4e121
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8ef14be1be9be9fb7e0516c7c0872ebe
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c554724e70bdb4900f874fa794995f43 |
| publicationDate |
2021-07-01^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
DE-102020133879-A1 |
| titleOfInvention |
CAP THICKNESS AND MATERIAL COMBINATIONS FOR IMPROVED HIGH FREQUENCY MICROPHONE PERFORMANCE |
| abstract |
A microphone arrangement contains a substrate, an acoustic transducer, an integrated circuit and a cover which is coupled to the substrate and encloses a rear space of the microphone arrangement in which the acoustic transducer and the integrated circuit are arranged. The acoustic transducer includes a mounting plate and a diaphragm which is aligned parallel to the mounting plate and which is arranged over an opening in the substrate in order to receive acoustic signals. The cover is a metallic material with a thickness and an appropriate thermal conductivity for attenuating incoming radio frequency signals. The attenuation of the high-frequency signals suppresses ambient noise that can be detected by the microphone arrangement. |
| priorityDate |
2019-12-30^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |