| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_1476752f2420c8f8eb53464cf7fc922b |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-405
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01G4-008
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-48
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01P11-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B1-026 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01P7-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-48
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B1-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01P11-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01G4-008
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01P7-10 |
| filingDate |
2002-04-23^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0a470024afbc824add0a05354d124743
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_50c9041aeacfb8a384ccdbae43160292 |
| publicationDate |
2003-02-27^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
DE-10218077-A1 |
| titleOfInvention |
Electroless copper plating solution and high-frequency electronic component |
| abstract |
An electroless copper plating solution is provided which can ensure excellent adhesion of a copper plating layer to a flat ceramic surface with little roughness and which can form a high frequency electronic component with excellent high frequency conductivity and high Q value. Furthermore, a high-frequency electronic component is provided, which is formed using this electroless copper plating solution. The electroless copper plating solution contains copper ions, nickel ions, formaldehyde or a derivative thereof and tartaric acid or a salt thereof. The ratio of the proportion of nickel ions to that of the molar-based copper ions is in the range of about 0.0001 to 0.015. |
| priorityDate |
2001-04-24^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |