| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_9884b2360f2413d7edea0d5af39f775a |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48091
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-56
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-54
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-507
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-60
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-16195
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L25-0753
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48247
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48465 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-486 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L25-075
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L33-54 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L33-48 |
| filingDate |
2003-02-28^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7333a4b482cd816cffd1417253b242d1
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5912b757985b4ae5809e5ea81afbe489
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8b5e34ed24b9f619cd895965aaca8286 |
| publicationDate |
2004-09-09^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
DE-10308866-A1 |
| titleOfInvention |
Lighting module and method for its production |
| abstract |
The invention relates to a lighting module with at least one thin-film light-emitting chip chip that is applied to a chip carrier and has a first and a second electrical connection side and an epitaxially produced semiconductor layer sequence. The semiconductor layer sequence has an n-type semiconductor layer, a p-type semiconductor layer and a region which generates electromagnetic radiation and is arranged between these two semiconductor layers and is arranged on a carrier. In addition, it has a reflective layer on a main surface facing the carrier, which reflects at least some of the electromagnetic radiation generated in the semiconductor layer sequence back into the latter. The semiconductor layer sequence has at least one semiconductor layer with at least one microstructured, rough surface. The outcoupling surface of the thin-film light-emitting diode chip is essentially defined by a main surface facing away from the reflecting layer and is free of housing material such as potting or encapsulation material. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/DE-102008054029-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/DE-102004047727-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-1840977-A4
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7462878-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/DE-102012219040-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8067783-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-1840977-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/DE-102004047727-B4
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7750358-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-1786043-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8461579-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/DE-102007008524-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8106584-B2 |
| priorityDate |
2003-02-28^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |