| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_36f8253f3d0d59bcd9259217d4385d10 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-386
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-10734
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-036
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-111
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0133
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-3436
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0355 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0271
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49816 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-11
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-34
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-60
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-50
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-498
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-02 |
| filingDate |
2003-07-30^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2007-03-01^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f543bd47961093beeef34c9b0ad62eb2
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d49d605b60361e60a5c9132a8bde44a4
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3cf378b8c6e4f514e12b5983f3d4f0b4 |
| publicationDate |
2007-03-01^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
DE-10335182-B4 |
| titleOfInvention |
Arrangement for improving the module reliability |
| abstract |
arrangementnat the chips with a Die attach material attached to a substratenare, where on the side opposite to the chip on contact padsna laminated on the substrate and photolithographically structurednCopper foil mounted solder balls fornelectrical connection with printed circuit boards are arranged and wherenthe chip and the substrate on the chip side with a mold capnare encapsulated, being between the contact pads (2) and interconnectsn(4) the copper foil and the substrate (1) an intermediate layer (3)na flexible or flexible material is inserted,nwherein the interconnects (4) and the contact pads (2) for receiving thensolder ballsn(5) are in the same plane and that the intermediate layer (3)nand the copper layer is photolithographically patterned togethernare.. |
| priorityDate |
2003-07-30^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |