http://rdf.ncbi.nlm.nih.gov/pubchem/patent/DE-112007003197-B4
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_51d028c578ae85cb937b5b34a5129fbc |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0738 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-167 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-10196 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0237 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0254 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-024 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01P3-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01P3-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-023 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01P3-08 |
| filingDate | 2007-12-06^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2013-04-18^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_aa81423dee2a27763ae226de0e554693 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_529afc18ce82cff08b89ba489974d07a |
| publicationDate | 2013-04-18^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | DE-112007003197-B4 |
| titleOfInvention | Apparatus and method for high speed signals on a printed circuit board |
| abstract | A device comprising: a printed circuit board substrate (12; 22); a copper signal line (14; 24; 44; 54; 61; 108; 118; 119) disposed on the printed circuit board substrate (12; 22); and a non-linear transmission structure (16; 26; 46; 56; 68; 109; 120; 121) coupled to the copper signal line (14; 24; 44; 54; 61; 108; 118; 119), wherein the non -linear transfer structure (16; 26; 46; 56; 68; 109; 120; 121) is disposed in a semiconductor device package (55; 68) comprising a folded signal conductor (67), and wherein the non-linear transfer structure (16; 121; 121) comprises a plurality of varactors (28; 48; 58; 63) on the folded signal conductor (67) which are spaced within one eighth of a characteristic wavelength of a high speed signal pulse, and wherein -linear transmission structure (16; 26; 46; 56; 68; 109; 120; 121) is configured to sharpen a wavefront of the high-speed signal pulse in the semiconductor device package (55; 68). |
| priorityDate | 2006-12-28^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
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