| abstract |
A thermal flow meter is provided which can prevent it from being eaten due to adhesion of water or the like to a cut end portion of the lead exposed from the injection resin of the circuit package. A thermal flow meter 300 of the present invention is a thermal flow meter having a circuit housing 400 formed by attaching a detection element 518 to leads 544 and 545 supported by a support frame 512, molding with an injection molding resin, and cutting off the support frame 512, with cut end portions 544a and 545 a, the leads 544 and 545 exposed by cutting off the support frame 512 from the injection molding resin of the circuit case 400 are covered by a cover member 371. |