http://rdf.ncbi.nlm.nih.gov/pubchem/patent/DE-112016003359-T5
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_d78fe473c8a29219129bbc8bb50f6a59 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B27-0076 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67219 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B49-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02002 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-304 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B7-228 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B37-015 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B55-03 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B37-042 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-304 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B37-015 |
| filingDate | 2016-08-16^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f5547428331814a30da3aaf86bff478e http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b768894ea623b3025bcbc59189743673 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6f9c8844600199370b37b2cfc4c33f26 |
| publicationDate | 2018-04-05^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | DE-112016003359-T5 |
| titleOfInvention | Polishing method and polishing device |
| abstract | The present invention provides a polishing method which comprises rubbing a wafer held by holding means against a polishing pad attached to a turntable driven by a motor for rotation while cooling the turntable by a refrigerant flow path provided in the turntable, a coolant is supplied, and thus carries out the polishing, wherein the polishing process is characterized in that during a standby after completion of polishing the wafer and before performing the polishing of a next wafer, the flow rate of the coolant regulated so is that it is less than the flow rate of the coolant during the polishing, in which the wafer is polished, the turntable is rotated by the motor and the polishing pad is supplied with a water-containing liquid having a temperature set to room temperature or higher. Consequently, the polishing method and the polishing apparatus which prevent the temperature of the turntable from lowering during standby and eliminate the need for dummy polishing before resuming polishing are provided. |
| priorityDate | 2015-09-03^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
| Predicate | Subject |
|---|---|
| isDiscussedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419512635 http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID962 |
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