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filingDate 1997-11-26^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2011-02-17^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_50ecb16f1eec2a1b668b473cc606b128
publicationDate 2011-02-17^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber DE-19752319-C5
titleOfInvention An ultrasonic wire-bonding apparatus comprising a device for testing a bond connection and a method for testing a bond connection produced by means of an ultrasonic wire-bonding tool
abstract An ultrasonic wire bonding apparatus comprising a device for testing a bond connection, comprising: - a bonding tool (26; 48) drivable by ultrasound to ultrasonically bond a wire (22; 46) to a substrate (102; 178) disposed thereunder; - a clamp (24; 40) for holding the wire (22; 46) to be bonded by the bonding tool (26; 48), the clamp (24; 40) and the bonding tool (26; 48) being disposed on a bonding head; and Means for moving the bonding head and the clip (24; 40) disposed thereon while the wire (22; 46) that has been bonded is held with a predetermined force to determine if the bond will withstand this force.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9919471-B2
priorityDate 1996-11-27^^<http://www.w3.org/2001/XMLSchema#date>
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