http://rdf.ncbi.nlm.nih.gov/pubchem/patent/DE-4029609-A1

Outgoing Links

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classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-346
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-34
filingDate 1990-09-19^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_50c6ef9c7ccea91446af1c3a352ac12a
publicationDate 1992-04-02^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber DE-4029609-A1
titleOfInvention METHOD FOR APPLYING AN ANTI-STABLE PATTERN TO A SUBSTRATE
abstract Formation of an etch-resistant pattern on a substrate comprises a) formation of a photoresist layer on a flat, transparent carrier substrate; b) formation of a photoresist pattern in the photoresist layer; c) lamination of the photoresist pattern carrier substrate onto a receiving substrate using a curable liq. adhesive between both substrates, where the photoresist side lies opposite the receiving substrate side, d) hardening of the liq. adhesive by heating or pref. by actinic photo-irradiation and removal of the carrier substrate for transfer of the photoresist pattern onto the receiving substrate, and e) dry-development of the pattern transferred from the carrier substrate by oxygen plasma- or oxygen reactive ion etching on the receiving substrate. USE/ADVANTAGE - Useful for formation of micropatterns and for prodn. of integrated switching circuits. Sufficient pattern reproduction is realised with simple good reproduction with minimisation of the influence of substrate topography.
priorityDate 1990-09-19^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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