| abstract |
The invention provides a polishing method which comprises the steps of forming a film to be polished on a substrate which has a recessed section in its surface, in order thus to fill at least the recssed section, and the selective leaving of the film to be polished in the recessed section by polishing the film with the use of a polishing agent which contains polishing particles and a solvent and has a pH value of 7.5 or more. The invention furthermore provides a polishing device which has a polishing-agent storage container (87) for storing a polishing agent, a turntable (84) for polishing an object to be polished, a polishing-agent supply tube (89) for supplying the polishing agent from the polishing-agent storage container (87) onto the turntable (84), a polishing-object clamping device (81) for holding the object to be polished, so that that surface of the object which is to be polished lies opposite the turntable (84), and a polishing-agent supply-tube temperature-setting unit (92) which is connected to the polishing-agent supply tube (89), in order to set the temperature of the polishing agent. <IMAGE> |