| abstract |
Metal substrates such as pipes and pipelines are often protected from corrosion by providing the substrate with a protective cover that is bonded to the substrate by. means of a sealant. In addition, a cathodic potential may be applied to the substrate to prevent loss of ions from the substrate due to electrochemical reactions. This can, however, lead to disbonding of the cover by a phenomenon known as "cathodic disbonding". n Cathodic disbonding may be reduced according to the invention by incorporation in the sealant at least 0.01 %, preferably at least 0.1% by weight of an organic, non-phenolic polyhydroxy compound, for example a mono- or polysaccharide, a synthetic hydroxy-containing polymer or a polyhydric alcohol. The sealant may be provided as a precoated layer on a cover for the substrate, preferably on a dimensionally heat-recoverable cover. |