| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_1f85e5b957e0ea701679b3e4ad45d78b |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K2101-42
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-088
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0746
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0776
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-1509
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-044 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K1-018
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K1-085
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-3468
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K1-015 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-34
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K1-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-24
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K1-015
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K1-018 |
| filingDate |
1984-05-10^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_801237d5d038e4f54838d552b1f794ba
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8819cad925aa6d4caf0cf110b0425b03
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a600f4beb6c64df94501fa19ea8a8569
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_751ed15f47380ce93261742c1970acb3 |
| publicationDate |
1985-07-17^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
EP-0148650-A1 |
| titleOfInvention |
Apparatus for solder removal |
| abstract |
A solder levelling system for use in vapor phase soldering systems for solder coating and levelling of printed wiring boards includes a board transport system (24) which operates in a near-horizontal mode for moving the board to be solder coated into and out of a vapor zone in a chamber (36) having a solder pot (30) which has a throat (32) in line with the plane of the transport system. The near-horizontal product movement through the vapor and into and out of the solder pot prevents solder sag associated with vertically loaded systems and permits variations in coating thickness through control of solder deposited on the opposing board surfaces. Levelling is accomplished with nozzles (64-66) positioned in a vapor-filled chamber to either side of the board transport system between the solder pot (30) and the throat (34) of the chamber, in which perpendicular nozzle offset distance from the borad as well as nozzle angle are adjustable by rotation and translation of a sector to which each nozzle is secured. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-109890548-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-0243478-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-0243478-A4
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-8900905-A1 |
| priorityDate |
1983-11-28^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |