http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-0275891-A3
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2666-16 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0133 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-181 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-389 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L29-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J123-34 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B3-30 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-387 |
| classificationIPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-18 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B3-30 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-38 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J123-34 |
| filingDate | 1988-01-12^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 1989-10-18^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | EP-0275891-A3 |
| titleOfInvention | Bonding compositions for the manufacture of additive printed wiring boards and printed wiring boards made with the bonding composition |
| abstract | This invention concerns a bonding composition useful nfor the manufacture of fully and semi-additive printed nwiring boards. The composition comprises a phenolic nresin substantially free of methyl ether groups with nan average of four to ten phenolic rings per molecule nand at least two methylol functional groups; at least none heat resistant polymer with an aromatic or cyclic nbackbone and functional groups capble of crosslinking nwith the phenolic methylol groups without evolving nwater and present in an amount sufficient to react nwith the methylol groups; and 30 to 60% by weight of nan elastomer. The composition is applied and cured on na printed wiring base material. After curing, the comnposition is capable of being adhesion promoted for adnherent electroless metal deposition. The bonding comnposition is capable of maintaining the bond of the denposited metal for 10 seconds during repair cycles with na soldering iron at 430°C. |
| priorityDate | 1987-01-14^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
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