http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-0318169-A3
Outgoing Links
Predicate | Object |
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classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-526 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-0091 |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-526 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-52 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-00 |
filingDate | 1988-11-07^^<http://www.w3.org/2001/XMLSchema#date> |
publicationDate | 1991-09-11^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | EP-0318169-A3 |
titleOfInvention | Phosphite modified epoxy resin |
abstract | This invention relates to adhesives, and more nparticularly, epoxy adhesives. n The automotive industry has used sheet molding ncompound (SMC) for manufacture of parts for automobile nbodies. Sheet molding compound typically comprises nspecialty thermosetting polyester resins, reinforcing nfibers, thickeners to increase the viscosity of the resin nand to facilitate handling, catalysts to cure the resins, nfiller to lower cost, improve the surface, or add specific nproperties, mold release agent, and pigment. n Thermoplastic copolymers have been incorporated in nsheet molding compound in an effort to improve the nappearance of painted SMC automobile components. The use nof thermoplastic copolymers in SMC formulations has nresulted in severe bonding problems for conventional nrepair adhesives. At present, there are no after market nadhesives suitable for repairing parts made of SMC. n This invention provides a composition comprising nan epoxy resin, an adduct of a tetra-substituted titanate nand a di-substituted hydrogen phospite, a neutral ester of na phosphorous acid, and a curing agent for the epoxy nresin. n The composition is particularly useful as an nadhesive for bonding structures made of sheet molding ncompound to like structures, to steel, and to other nsubstrates commonly used in the automotive area. |
priorityDate | 1987-11-23^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
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