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filingDate 1990-01-30^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 1990-08-29^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber EP-0384586-A2
titleOfInvention High reliability plastic package for integrated circuits
abstract A high reliability plastic package (30) which includes palladium plated and solder dipped leads (18) for electrical connection to electrical components as well as a support (10) for electrically contacting a seminconductor integrated circuit device is disclosed. A method for manufacturing such package is also disclosed.
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priorityDate 1989-02-22^^<http://www.w3.org/2001/XMLSchema#date>
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