http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-0420405-A2

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filingDate 1990-08-10^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a7c0d59fd4b23ebc95ec3019a8dc1f2b
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publicationDate 1991-04-03^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber EP-0420405-A2
titleOfInvention Integrated circuit comprising interconnections
abstract A multilevel electrically conductive interconnect (12,20) is provided for an integrated circuit wherein an intermediate dual dielectric layer (18) is formed between the non-contacting portions of the conductors forming the conductive interconnect. The dual dielectric layer consists of a first dielectric layer (14) and a second dielectric layer (16), the latter, being formed from a polyimide material. The dual dielectric layer provides a significant improvement in defect density and a substantially planarized surface (26) for the deposition of the top conductor (20), thereby improving the reliability and integrity of the electrical interconnection and of the integrated circuit.
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priorityDate 1989-08-31^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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