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filingDate 1993-12-02^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d8eefeafd6b65e397b59748e8232063f
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publicationDate 1994-06-08^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber EP-0600482-A2
titleOfInvention Resin composition for laminates
abstract A resin composition containing 50 to 99 % by weight of component A, which is a copolymer of ethylene and α-olefin, and 1 to 50 % by weight of component B, which is a high-pressure low-density polyethylene. The component A has (a) a melt flow rate (MFR) of 2 to 30 g/10 min., (b) a density of not more than 0.935 g/cm³, and (c) a single peak of elution volume indicated by an elution curve obtained by temperature rising elution fractionation, the peak corresponding to a temperature within a range of from 20°C to 85°C, and the elution curve satisfying a relationship in which the ratio H/W is not less than 1 when H represents the height of the peak and W represents the width of the elution curve at half of the height H. The component B has (a') a melt flow rate of 0.1 to 20 g/10 min., (b') a density of 0.915 to 0.93 g/cm³, ('c) a memory effect (ME) of not less than 1.6, and (d') a melt tension (MT) of not less than 1.5 g. The resin composition is advantageously usable as a laminate material having improved workability, and excellent properties with respect to low-temperature heat sealability, heat sealing strength and hot tack.
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