| abstract |
This invention relates generally to structure and method for preventing metal diffusion between a noble metal layer and an adjoining non-noble metal layer, and more specifically to new structures and methods for providing a superbarrier structure between copper and an adjoining noble metal layer. The attached drawing shows the basic metal film structure deposited on a substrate (12). The layers or films are deposited sequentially within a vacuum system without breaking the vacuum by any suitable technique. An electrically conductive adhesion layer (15) is first deposited directly on the substrate (12), so that it is electrically in contact with at least a portion of at least one via connection (14). This is followed by a layer of non-noble metal (16), and a layer of titanium (17), deposited directly thereon. Next a layer of molybdenum (18), is deposited over the layer of titanium (17), and, finally a layer of noble or relatively less noble metal layer (20), is deposited on the molybdenum layer (18). These deposited layers are the typically formed into an array of pads. These pads can now be used to connect various components such as wires, pins, connectors etc. This invention also relates to an improved multilayer metallurgical pad or metallurgical structure for mating at least a portion of a pin or a connector or a wire to a substrate. |