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publicationDate 1996-03-20^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber EP-0702408-A2
titleOfInvention Package for mounting a semiconductor device
abstract A package (2) for mounting a semiconductor device (18) comprises a base plate (4), and a conductive layer (12, 14, 16) laminated onto the base plate (4) via an adhesive layer (6, 8, 10). The modulus of elasticity at 25 °C of the adhesive layer (6, 8, 10) is 98.07 N/mm² (10 kg/mm²) or less.
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priorityDate 1994-09-16^^<http://www.w3.org/2001/XMLSchema#date>
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