| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_069a92549123806a5d654dc036a676e9 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-7684
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76888
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-53233
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-288 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-3205
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-52
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-532
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-288 |
| filingDate |
1998-09-18^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_cdb0a88a781c044a0afebd6dcb38ffc5
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_cbf7bda1618575c7e4c9e21aa3e72123 |
| publicationDate |
1999-07-21^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
EP-0903781-A3 |
| titleOfInvention |
Method of forming embedded copper interconnections and embedded copper interconnection structure |
| abstract |
An embedded interconnections of copper is formed bynforming an insulating layer, forming an embeddedninterconnections of copper in the insulating layer, planarizingnan exposed surface of the insulating layer including an exposednsurface of the embedded interconnections of copper according tonchemical mechanical polishing, and forming a protective film ofnsilver on the exposed surface of the embedded interconnectionsnof copper. These steps are repeated on the existing insulatingnlayer thereby to produce multiple layers of embeddedninterconnections of copper. The exposed surface of the embeddedninterconnections of copper is plated with silver according tonimmersion plating. |
| priorityDate |
1997-09-18^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |