| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_2cb72657cf0479385a9b5e655af1e16f |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2201-02 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L23-0869
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-36
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-296
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L81-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-5435 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-36
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L81-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-5435 |
| filingDate |
1999-12-22^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2003-04-16^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_91f7cccde7a79f9867e13ae2f3034f43
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_026ccb872f70d3faa297ab70fb28a9f5
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c3ebf1f4d4a1ed5cff8a4c74ae7c4170
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5a81f5ae0da6bad31c226f0e928f6cf5 |
| publicationDate |
2003-04-16^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
EP-1057871-B1 |
| titleOfInvention |
Polyarylene sulfide resin composition for electronic part encapsulation |
| abstract |
A polyarylene sulfide resin composition for electronic part encapsulation which comprises: 100 parts by weight of a base composition comprising 20 to 35 wt.% polyarylene sulfide resin (A), 60 to 75 wt.% silica (B), and 1 to 10 wt.% elastomer (C); and 0.05 to 1.2 parts by weight of an epoxy silane (D) and/or 0.1 to 3 parts by weight of an epoxy resin (E). The PAS resin composition is excellent in resistance to moist heat and thermal shock and in flowability while retaining the satisfactory properties inherent in the PAS resin itself. It is suitable for use as an encapsulation material for electronic parts, and neither deforms bonding wires, etc. nor causes package breakage. |
| priorityDate |
1998-12-24^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |