| abstract |
The invention provides means for effectively preventing a wire disconnection generated due to an increase of calorie applied to a semiconductor integrated circuit device. The semiconductor integrated circuit device is structured such that a metal layer containing a Pd layer is provided in a portion (4) to which a connecting member (19) having a conductivity is connected, and an alloy layer having a melting point higher than that of an Sn-Pb eutectic solder and containing no Pb as a main composing metal is provided outside a portion molded by a resin (24). Further, a metal layer in which a thickness in a portion to which the connecting member having the conductivity is adhered is equal to or more than 10 mu m is provided in the connecting member. <IMAGE> |