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filingDate 2001-06-29^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d245d2827b04587ed998ef15c87adf2b
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publicationDate 2002-01-02^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber EP-1167585-A2
titleOfInvention Method and apparatus for forming interconnects, and polishing liquid and polishing method
abstract There are provided a method and apparatus for formingninterconnects by embedding a metal such as copper (Cu) intonrecesses for interconnects formed on the surface of ansubstrate such as a semiconductor substrate. The method ofnthe present invention includes the steps of: providing ansubstrate having fine recesses formed in the surface;nsubjecting the surface of the substrate to plating in anplating liquid; and subjecting the plated film formed on thensurface of the substrate to electrolytic etching in an etchingnliquid.
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