| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_a19c6ef113a6f71bda0ce9f47c1a8ebe |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0358
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0195
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4652
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-2495
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-24917
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0141 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4655 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46 |
| filingDate |
2001-12-13^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e3ed90703ed98bd06ad098e3832bdbb7
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_78d4ecd2f657068ff480adeaa202f454 |
| publicationDate |
2003-09-10^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
EP-1342395-A2 |
| titleOfInvention |
Multi-layer circuits and methods of manufacture thereof |
| abstract |
A multi-layer circuit comprises a circuit (18) and a resin covered conductive layer (12) disposed on the circuit (18), wherein the resin covered conductive layer (12) comprises a liquid crystalline polymer resin (16) laminated to a conductive layer (14). Such multi-layer circuits are particularly useful for high density circuit applications. |
| priorityDate |
2000-08-15^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |