| abstract |
The invention provides an aqueous dispersion fornchemical mechanical polishing that is hard to putrefy,nscarcely causes scratches, causes only small dishing and isnsuitable for used in a micro isolating step or anplanarizing step of an inter layer dielectric in productionnof semiconductor devices. n The aqueous dispersion for chemical mechanicalnpolishing comprises ceria particles, a preservativencomposed of a compound having a heterocyclic structurencontaining a nitrogen atom and a sulfur atom in the ring,nsuch as an isothiazolone compound, and an organic componentnsuch as organic abrasive grains composed of resin particles,na dispersing agent composed of a water-soluble polymernhaving a specific molecular weight or the like, ansurfactant and/or an organic acid or a salt thereofncontained in an aqueous medium. The ceria particles,npreservative and organic component are contained innproportions of 0.1 to 20 % by mass, 0.001 to 0.2 % by massnand 0.1 to 30 % by mass, respectively, when the totalnproportion of the aqueous medium, ceria particles,npreservative and organic component is 100 % by mass. ThenpH of this aqueous dispersion can be kept in a neutralnrange. |