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publicationDate 2006-07-12^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber EP-1679354-A1
titleOfInvention Hot melt adhesive composition
abstract A low application temperature, high heat resistant hot melt adhesive comprising an ethylene n-butyl acrylate copolymer having a melt index (MI) of 750 grams/10 minutes or higher and an ethylene vinyl acetate (EVA) polymer having a MI of 750 grams/10 minutes or higher are particularly well suited for case and carton sealing operations.
priorityDate 2003-10-07^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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