| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c5520dd38cc403678d9f91e0b0ee95fb |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-8592
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05554
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48091
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-49175 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-14618
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-043
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L25-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-14625
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-146 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H04N5-225
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L27-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H04N5-335
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L27-146 |
| filingDate |
2006-03-24^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_43368ba1a7212b3a9a1eb4c6220b0dd7
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7fc46bcf1a9be5ac9653c7c79973e4b4 |
| publicationDate |
2006-10-04^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
EP-1708269-A1 |
| titleOfInvention |
Semiconductor device module and manufacturing method of semiconductor device module |
| abstract |
In a module (1) for an optical device as a semiconductor device module of the present invention, a bonding wire (13) that electrically connects a substrate (10) on which a conductor wiring is formed and an image pickup element (11) as a semiconductor element is covered with a cover (40), and a holder (20) as a lid is placed over the cover (40). |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-2784819-A3 |
| priorityDate |
2005-03-29^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |