http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-1739463-B1
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_49f04b1dc6b9fcc2d8b159c5ebee364b |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T83-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G02B2006-12147 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G02B6-30 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G02B6-122 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G02B6-13 |
| classificationIPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G02B6-30 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G02B6-13 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G02B6-122 |
| filingDate | 2005-04-21^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2012-08-08^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2817d706f6cb2357ba2baae002c0ce85 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_bcfa9fe4b3720ceefadf16ade618fbdb |
| publicationDate | 2012-08-08^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | EP-1739463-B1 |
| titleOfInvention | Optical waveguide chip and method of manufacturing the same |
| abstract | An optical waveguide chip having a structure for effectively avoiding or suppressing the peeling of an optical waveguide layer when a wafer is cut off, comprising a substrate having a principal plane and the optical waveguide layer formed on the principal plane of the substrate. The optical waveguide layer further comprises clad parts and a core part installed in the clad parts and having a refractive index higher than that of the clad parts. At least a part of the side faces of the optical waveguide layer is shifted a specified distance from the edge to the center of the principal plane. By this structure, the optical waveguide layer contains a structure having a thin-film portion in the peripheral area thereof having the edge of the principal plane. Like this, when the optical waveguide layer comprises the thin-film portion therearound, the optical waveguide layer comprises the side faces matching the side faces of the substrate containing the edge of the principal plane and the side faces apart a specified distance from the edge of the principal plane. By this structure, when the wafer is cut off in the unit of chip, even if chipping occurs on the substrate to be cut off at the edge of the principal plane, the peeling of the optical waveguide layer formed on the substrate can be effectively suppressed. |
| priorityDate | 2004-04-22^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
| Predicate | Subject |
|---|---|
| isDiscussedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID69667 http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID129389030 |
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