| abstract |
The invention relates to a multilayer structure such as a booklet cover paper, including passport.n n n It comprises a radiofrequency identification device (31, 32) having a chip (31), which is housed in the thickness of the multilayer structure without generating excess thickness, the materials constituting the different layers of the multilayer structure are chosen , as well as the thickness of said layers, so that the cover (20) is resistant to mechanical and thermal shock, in particular can undergo a graining and / or embellishment treatment by depositing a film by hot transfer and under pressure and / or lamination during security film deposition, the chip (31) being located near a fold (21). |