| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_424db9d56b06a23aed410fcf5df652f3 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2307-206
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2307-3065
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2307-306
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2307-54
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2457-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2457-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2264-108
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2264-102 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B15-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B27-36
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B25-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B27-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B27-281
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B9-005
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B25-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B25-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B15-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-6833 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-683
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23B5-16 |
| filingDate |
2007-04-27^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f6830dbbcca629d993c407a19db74183
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_801f891e08ab71b19141a5a4a49d17e5
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e48589d32144f7d2521d3142fdc7bd38 |
| publicationDate |
2007-10-31^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
EP-1850376-A2 |
| titleOfInvention |
Electrostatic chuck |
| abstract |
An electrostatic chuck comprises an insulating layer with an electrode embedded therein and having a surface to come in contact with a workpiece to be held. Formed on the insulating layer surface is a silicone rubber layer which is filled with reinforcing silica, but free of another filler having an average particle size of at least 0.5 µm. The ESC allows for an intimate contact with a wafer and has an improved cooling capacity. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7940512-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-1986228-A1 |
| priorityDate |
2006-04-28^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |