http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-1871855-B1
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_f7fb8e9adad52abb74b28b5975feb57a |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02074 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-32125 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-3212 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09G1-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K3-1463 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09K3-14 |
| filingDate | 2006-03-24^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2010-03-24^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_19e85df2f062175191d1231420f10a64 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e903615eb5de37db5e9c24bf2fbbc150 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_bb6d71bc67ae9eee1a87331a11942cfc http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_85ca3d9486f7299f0a5f1548c1fc3214 |
| publicationDate | 2010-03-24^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | EP-1871855-B1 |
| titleOfInvention | Dihydroxy enol compounds used in chemical mechanical polishing compositions having metal ion oxidizers |
| abstract | A chemical mechanical polishing composition contains 1) water, 2) optionally an abrasive material, 3) an oxidizer, preferably a per-type oxidizer, 4) a small amount of soluble metal-ion oxidizer/polishing accelerator, a metal-ion polishing accelerator bound to particles such as to abrasive particles, or both; and 5) at least one of the group selected from a) a small amount of a chelator, b) a small amount of a dihydroxy enolic compound, and c) a small amount of an organic accelerator. Ascorbic acid in an amount less than 800 ppm, preferably between about 100 ppm and 500 ppm, is the preferred dihydroxy enolic compound. The polishing compositions and processes are useful for substantially all metals and metallic compounds found in integrated circuits, but is particularly useful for tungsten. The present invention also pertains to surface-modified colloidal abrasive polishing compositions and associated methods of using these compositions, particularly for chemical mechanical planarization, wherein the slurry comprises low levels of chelating free radical quenchers, non-chelating free radical quenchers, or both. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I503407-B |
| priorityDate | 2005-03-25^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Showing number of triples: 1 to 494 of 494.